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Repurposing of secondary batteries - Part 2: Classification of batteries to be repurposed - Safety and performance estimation methods
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Assessment of circular content in products - Part 3: Proportion of recycled materials (Proposed Horizontal Publication)
30.99 CD approved for registration as DIS
Electronic displays for special applications - Part 4: Public information and signage
20.99 WD approved for registration as CD
Electronic displays for special applications - Part 5: Review of relevance of display standards to automotive application
20.99 WD approved for registration as CD
Low-voltage auxiliary power systems - Part 2-1: Design criteria - General requirements
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Low-voltage auxiliary power systems - Part 2-2: Design criteria - Low-voltage DC auxiliary power systems for substations
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Smart city use case collection and analysis - Managing public health emergencies in smart cities - Part 2 : Use case analysis
50.60 Close of voting. Proof returned by secretariat
Guideline for the planning and design of direct current or hybrid microgrids
20.99 WD approved for registration as CD
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 2: Transient conditions
30.20 CD study/ballot initiated
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 3: dynamic conditions
20.99 WD approved for registration as CD
Semiconductor devices - Semiconductor devices for IoT system - Part 2: Test method of semiconductor photon sources incorporating human factors for wearable equipment
30.60 Close of voting/ comment period
Carbon footprint calculation applicable to industrial lithium-ion batteries - Part 1: General requirements and methodology
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
40.20 DIS ballot initiated: 12 weeks
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
40.20 DIS ballot initiated: 12 weeks
Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
50.99 FDIS or proof approved for publication
Hybrid CPV/PV modules: General characteristics and measurement procedures - Part 1: Performance measurements and power rating - Irradiance and temperature
40.99 Full report circulated: DIS approved for registration as FDIS
Technical Specifications for Digitalization of Operation and Maintenance in Hydropower Assets
20.99 WD approved for registration as CD
Sustainable management of waste electrical and electronic equipment (e-waste) (Proposed Horizontal Publication)
50.60 Close of voting. Proof returned by secretariat