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Industrial networks – 5G Communication Technology – Part 1: Terms, definitions and fundamentals
40.00 DIS registered
Replay Tools for radioactive material detection systems
30.60 Close of voting/ comment period
Application of IEC 63339 to Smart Manufacturing Reference Models
50.00 Final text received or FDIS registered for formal approval
Application of IEC 63339 to smart manufacturing reference models
30.99 CD approved for registration as DIS
Plugs, socket-outlets, ship couplers for low-voltage shore connection systems (LVSC-systems) in Direct Current (DC)
20.99 WD approved for registration as CD
Guidelines for joint control for hydroelectric power plants
20.99 WD approved for registration as CD
Evaluation of hydrophobicity retention of polymeric insulating materials under high voltage stress with the dynamic drop test
30.60 Close of voting/ comment period
Guideline for evaluating bias temperature instability of silicon carbide metal-oxide-semiconductor devices for power electronic conversion (Fast track)
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Guidelines for representing switching losses of SIC MOSFETs in datasheets (Fast track)
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Arc Hazards and Safety in LVDC - Part 1: Series arc characteristics between brass electrodes
20.99 WD approved for registration as CD
Performance of power electronics transformer for flexible transmission and distribution systems
20.99 WD approved for registration as CD
Grid compliance test for photovoltaic power plants
20.99 WD approved for registration as CD
Hazard analysis due to using C-UAS system in nuclear site
50.00 Final text received or FDIS registered for formal approval
Quantum technologies – Terminology and quantities – General quantities
20.99 WD approved for registration as CD
Semiconductor devices - Reliability test methods for vibration energy harvesters - Part 1: Mechanical reliability under shock
30.60 Close of voting/ comment period
Reliability evaluation methods for vibration energy harvesters - Part 2: Temperature and humidity
20.99 WD approved for registration as CD
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 1: Guideline for thermal design of applications where the heat dissipation path to the board is dominant
30.20 CD study/ballot initiated
Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements
30.20 CD study/ballot initiated
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