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Electronic displays for special applications - Part 5: Review of relevance of display standards to automotive application
20.99 WD approved for registration as CD
Low-voltage auxiliary power systems - Part 2-1: Design criteria - General requirements
50.00 Final text received or FDIS registered for formal approval
Low-voltage auxiliary power systems - Part 2-2: Design criteria - Low-voltage DC auxiliary power systems for substations
50.00 Final text received or FDIS registered for formal approval
Smart city use case collection and analysis - Managing public health emergencies in smart cities - Part 2 : Use case analysis
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Household electric appliances - Specification of the properties of a digital system for measuring the performance
60.00 Standard under publication
IIoT applications in power distribution systems management: Architecture and functional requirements
60.00 Standard under publication
Guideline for the planning and design of direct current or hybrid microgrids
20.99 WD approved for registration as CD
LED light source characteristics - Part 1: Data sheets
60.00 Standard under publication
Fluids for electrotechnical application: Specifications for the re-use of mixtures of gases alternative to SF<sub>6</sub>
50.60 Close of voting. Proof returned by secretariat
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 2: Transient conditions
30.60 Close of voting/ comment period
Semiconductor devices - Semiconductor devices for IoT system - Part 2: Test method of semiconductor photon sources incorporating human factors for wearable equipment
30.60 Close of voting/ comment period
Carbon footprint calculation applicable to industrial lithium-ion batteries - Part 1: General requirements and methodology
50.60 Close of voting. Proof returned by secretariat
Materials used in photovoltaic (PV) cells - Part 1: Specifications for electrical characteristics of crystalline silicon wafers
60.00 Standard under publication
Quantification and communication of carbon footprint, GHG emission reductions and avoided emissions from electric and electronic products and systems - Principles, methodologies, requirements and guidance
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages
40.00 DIS registered
Thermal standardization on semiconductor packages - Part 4: Thermal evaluation board specifications for fine pitch semiconductor packages
40.00 DIS registered
Thermal standardization on semiconductor packages - Part 6: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points
60.00 Standard under publication
Thermal standardization on semiconductor packages - Part 6-1: Thermal resistance and capacitance model for transient temperature prediction at junction and measurement points - Model creation method using a datasheet of semiconductor device
40.60 Close of voting
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