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Semiconductor devices - Standardization roadmap of fault test method for automotive vehicles
60.60 Standard published
Graphical symbols for diagrams - Part 1: General, qualifying and generic symbols
60.60 Standard published
Fluids for electrotechnical application - Specification of gases alternative to SF<sub>6</sub> to be used in electrical power equipment
60.60 Standard published
Application of fixed capacitors in electronic equipment - Part 1: Aluminium electrolytic capacitors
60.60 Standard published
Performance of voltage sourced converter (VSC) based high-voltage direct current (HVDC) transmission - Part 1: Steady-state conditions
60.60 Standard published
Semiconductor devices - Semiconductor devices for IoT system - Part 1: Test method of sound variation detection
60.60 Standard published
Industrial process measurement, control and automation - Digital nameplate
60.60 Standard published
Product category rules for life cycle assessment of electrical and electronic products and systems
60.60 Standard published
Fibre optic interconnecting devices and passive components - Summarising results of round robin on connector end face scratch recognition and verification by automated microscopes
60.60 Standard published
Control and protection systems for high-voltage direct current (HVDC) power transmission systems - Off-site real-time simulation testing
60.60 Standard published
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices
60.60 Standard published
Nuclear power plants - Instrumentation systems important to safety - Characteristics and test methods of nuclear reactor reactivity meters
60.60 Standard published
Industrial facility energy management system (FEMS) - Functions and information flows
60.60 Standard published
Procedures for the assessment of human exposure to electromagnetic fields from radiative wireless power transfer systems – Measurement and computational methods (frequency range of 30 MHz to 300 GHz)
60.60 Standard published
Thermal standardization on semiconductor packages - Part 1: Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages
60.60 Standard published
Thermal standardization on semiconductor packages - Part 2-1: 3D thermal simulation models of semiconductor packages for steady-state analysis - Discrete packages
60.60 Standard published
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
60.60 Standard published
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