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Residual current operated circuit-breakers for household and similar use - Part 3-2: Particular requirements for devices with flat quick-connect terminations
60.60 Standard published
Residual current operated circuit-breakers for household and similar use - Part 3-3: Specific requirements for devices with screw-type terminals for external untreated aluminium conductors and with aluminium screw-type terminals for use with copper or with aluminium conductors
60.60 Standard published
Guidance on the interpretation of carbon dioxide and 2-furfuraldehyde as markers of paper thermal degradation in insulating mineral oil
60.60 Standard published
Multimedia systems and equipment - Multimedia e-publishing and e-book technologies - Printing specification of texture map for auditory presentation of printed texts
60.60 Standard published
Nanotechnology - Reliability assessment - Part 2-1: Nano-enabled photovoltaic devices - Stability test
60.60 Standard published
Nanomanufacturing - Reliability assessment - Part 3-1: Graphene-based material - Stability: Temperature and humidity test
60.60 Standard published
Nanomanufacturing – Reliability assessment – Part 4-1: Nanophotonic products – Optical stability test of quantum dot enabled light conversion films: Temperature, humidity and light exposure
60.60 Standard published
Electrolyte and water for vented lead acid accumulators - Part 1: Requirements for electrolyte
60.60 Standard published
Electrolyte and water for vented lead acid accumulators - Part 2: Requirements for water
60.60 Standard published
Device embedded substrate - Part 1-1: Generic specification - Test methods
60.60 Standard published
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
60.60 Standard published
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
60.60 Standard published
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
60.60 Standard published
Device embedded substrate - Part 2-2: Guidelines - Electrical testing
60.60 Standard published
Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards
60.60 Standard published
Device embedding assembly technology - Part 2-8: Guidelines - Warpage control of active device embedded substrate
60.60 Standard published
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
60.60 Standard published
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