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IEC 62899-402-8 ED1

Printed electronics - Part 402-8: Printability - Measurement of qualities - Shape pattern dimension

General information

60.00     May 22, 2026

PPUB    Jul 3, 2026

IEC

TC 119

International Standard

31.180  

Scope

IEC 62899-402-8:2026(E) specifies the measurement methods of the dimensions of the shape patterns in printed electronics. These printed patterns are treated as two-dimensional on a substrate. When the patterns are definitely affected by three-dimensional configurations, these are specified in measurement methods for vertical variance in IEC TR 62899‑402‑4 in printed electronics.
NOTE The measurement methods of dimensions of the shape patterns considering three-dimensional characteristics can be developed later after the measurement methods for vertical variance are established.

Life cycle

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IN_DEVELOPMENT
IEC 62899-402-8 ED1
60.00 Standard under publication
May 22, 2026