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Guidance on material circularity considerations in environmentally conscious design
00.00 Proposal for new project received
Life extension guidelines for HVDC converter stations
00.00 Proposal for new project received
DC side harmonics and filtering in HVDC transmission systems
00.00 Proposal for new project received
Future IEC TR 62899-2XX-X: Materials - Measurement and assessment method of dispersibility in silver nano-ink
00.00 Proposal for new project received
IEC TR 62899-3XX : Equipment – Substrate - Sheet to sheet mechanical dimension
00.00 Proposal for new project received
Performance of power electronic reactive power shunt compensators in high-voltage alternating current (HVAC) systems
00.00 Proposal for new project received
PWI TR 22F-18 Performance of power electronics transformer for flexible transmission and distribution system
00.00 Proposal for new project received
Performance of power electronics transformer for flexible transmission and distribution systems
00.00 Proposal for new project received
Connectivity for Lighting Systems - Interoperability (functional), communication protocol and connectivity of lighting systems and/or connecting to total control systems
00.00 Proposal for new project received
Future IEC TR 62433-X : EMC IC modelling – Part X: Use of ICIM-CI model in an application board modelling
00.00 Proposal for new project received
Integrated circuits – Part X: Standardization Roadmap for Fan-Out Packages
00.00 Proposal for new project received
Future IEC TR 60191-7 Ed.1: Requirements to design electronics devices using thermal characteristics of semiconductor packages
00.00 Proposal for new project received
Future IEC TR 60191-7-3 Ed.1: Proposal of new thermal model format for semiconductor packages
00.00 Proposal for new project received
Future IEC TR 60191-7-5 Ed.1: 3D semiconductor package model for precise thermal analysis (JTAM)
00.00 Proposal for new project received
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