IEC 60191-6-2:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Publication date: 11 dhj 2001

General information

Current stage: 60.60 Effective date: 11 dhj 2001

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Publikuar

PDF - 4 523 Lekë

Paper - 4 523 Lekë

CD - 4 523 Lekë

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Scope

IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).

Life cycle

NOW

PUBLISHED
IEC 60191-6-2:2001 ED1
60.60 Standard published
11 dhj 2001

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60191-6-2:2001/COR1:2002 ED1