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IEC 60191-6-2:2001/COR1:2002 ED1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

General information

60.60     18 tet 2002

IEC

TC 47/SC 47D

International Standard

31.080.01  

Scope

Life cycle

PREVIOUSLY

PUBLISHED
IEC 60191-6-2:2001 ED1

NOW

PUBLISHED
IEC 60191-6-2:2001/COR1:2002 ED1
60.60 Standard published
18 tet 2002