IEC 60068-2-58:1999 ED2

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Publication date: 15 jan 1999

General information

Current stage: 99.60 Effective date: 15 korr 2004

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040 31.190

Gjuha: anglisht spanjisht

Buying

Statusi: Revised

PDF - 13 003 Lekë

Paper - 13 003 Lekë

CD - 13 003 Lekë

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Scope

Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.

The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-58:1989 ED1

NOW

WITHDRAWN
IEC 60068-2-58:1999 ED2
99.60 Withdrawal effective
15 korr 2004

REVISED BY

WITHDRAWN
IEC 60068-2-58:2004 ED3