IEC 60068-2-58:1989 ED1

Environmental testing. Part 2: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)

Publication date: 15 gush 1989

General information

Current stage: 99.60 Effective date: 15 jan 1999

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040 31.190

Gjuha: anglisht frëngjisht rusisht

Buying

Statusi: Revised

PDF - 9 046 Lekë

Paper - 9 046 Lekë

CD - 9 046 Lekë

Language

Language in which you want to receive the document.

Scope

Determines solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices. The procedure uses a solder bath and applies only to products designed to withstand short-term immersion in molten solder.

Life cycle

NOW

WITHDRAWN
IEC 60068-2-58:1989 ED1
99.60 Withdrawal effective
15 jan 1999

REVISED BY

WITHDRAWN
IEC 60068-2-58:1999 ED2