IEC 61189-2:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Publication date: 10 pri 1997

General information

Current stage: 99.60 Effective date: 30 maj 2006

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 41 271 Lekë

Paper - 41 271 Lekë

CD - 41 271 Lekë

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Scope

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-1:1982 ED2

WITHDRAWN
IEC 60249-1:1982/AMD4:1993 ED2

WITHDRAWN
IEC 60249-1:1982/AMD1:1984 ED2

WITHDRAWN
IEC 60249-1:1982/AMD2:1989 ED2

WITHDRAWN
IEC 60249-1:1982/AMD3:1991 ED2

NOW

WITHDRAWN
IEC 61189-2:1997 ED1
99.60 Withdrawal effective
30 maj 2006

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1

ABANDON
IEC 61189-2/AMD2 ED1

REVISED BY

PUBLISHED
IEC 61189-2:2006 ED2