IEC 61189-2:1997 ED1

Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Publication date: Apr 10, 1997

General information

Current stage: 99.60 Effective date: May 30, 2006

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Languages: English French

Buying

Status: Revised

PDF - ALL 41,271

Paper - ALL 41,271

CD - ALL 41,271

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Scope

Provides a catalogue of test methods representing methodologies and
procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60249-1:1982 ED2

WITHDRAWN
IEC 60249-1:1982/AMD4:1993 ED2

WITHDRAWN
IEC 60249-1:1982/AMD1:1984 ED2

WITHDRAWN
IEC 60249-1:1982/AMD2:1989 ED2

WITHDRAWN
IEC 60249-1:1982/AMD3:1991 ED2

NOW

WITHDRAWN
IEC 61189-2:1997 ED1
99.60 Withdrawal effective
May 30, 2006

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 61189-2:1997/AMD1:2000 ED1

ABANDON
IEC 61189-2/AMD2 ED1

REVISED BY

PUBLISHED
IEC 61189-2:2006 ED2