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IEC 60068-2-20:1979 ED4

Environmental testing. Part 2: Tests. Test T: Soldering
1 jan 1979

General information

99.60     21 korr 2008

IEC

TC 91

International Standard

19.040  

anglisht   frëngjisht   rusisht  

Buying

Revised

Language in which you want to receive the document.

Scope

Describes solderability tests on wire and tag terminations (Ta) and printed wiring boards (Tc), also describes tests for resistance to soldering heat, applicable to components (Tb).

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-20:1968 ED3

NOW

WITHDRAWN
IEC 60068-2-20:1979 ED4
99.60 Withdrawal effective
21 korr 2008

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60068-2-20:1979/AMD2:1987 ED4

WITHDRAWN
IEC 60068-2-20:1979/AMD1:1986 ED4

REVISED BY

WITHDRAWN
IEC 60068-2-20:2008 ED5