IEC 60068-2-20:2008 ED5

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Publication date: 21 korr 2008

General information

Current stage: 99.60 Effective date: 30 mar 2021

Next stage: WPUB

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 19.040

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 13 003 Lekë

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Scope

IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60068-2-20:1979 ED4

WITHDRAWN
IEC 60068-2-20:1979/AMD2:1987 ED4

WITHDRAWN
IEC 60068-2-20:1979/AMD1:1986 ED4

NOW

WITHDRAWN
IEC 60068-2-20:2008 ED5
99.60 Withdrawal effective
30 mar 2021

REVISED BY

PUBLISHED
IEC 60068-2-20:2021 ED6