Revised
IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
WITHDRAWN
IEC 63055:2016 ED1
99.60
Withdrawal effective
11 tet 2023
PUBLISHED
IEC 63055:2023 ED2
Formati për projektimin ndërveprues të bordit të paketës së qarkut të integruar me shkallë të madhe - LSI
60.60 Standard published