IEC 63055:2016 ED1

Format for LSI-Package-Board Interoperable design

Publication date: Nov 8, 2016

General information

Current stage: 99.60 Effective date: Oct 11, 2023

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180 31.200 35.060

Languages: English

Buying

Status: Revised

PDF - ALL 50,882

Paper - ALL 50,882

CD - ALL 50,882

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Scope

IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.

Life cycle

NOW

WITHDRAWN
IEC 63055:2016 ED1
99.60 Withdrawal effective
Oct 11, 2023

REVISED BY

PUBLISHED
IEC 63055:2023 ED2

National adoptions

SSH IEC 63055:2016

DPS

Format for LSI-Package-Board Interoperable design

60.60 Standard published

DPS/KT 9 more