IEC 63011-1:2018 ED1

Integrated circuits - Three dimensional integrated circuits - Part 1: Terminology

Publication date: 28 nën 2018

General information

Current stage: 60.60 Effective date: 28 nën 2018

Originator: IEC

Owner: TC 47/SC 47A

Type: International Standard

ICS: 31.200

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 63011-1:2018 provides definitions pertaining to multichip integrated circuits, as vertically stacked dies using through-silicon vias (TSVs) or micro bumps. Terms and definitions related to the fabrication and test of the multichip integrated circuits are also provided.

Life cycle

NOW

PUBLISHED
IEC 63011-1:2018 ED1
60.60 Standard published
28 nën 2018

National adoptions

SSH IEC 63011-1:2018

DPS

Qarqe të integruara - Qarqet e integruara tre përmasore - Pjesa 1: Terminologjia

60.60 Standard published

DPS/KT 7 më tepër