IEC 63011-2:2018 ED1

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Publication date: 28 nën 2018

General information

Current stage: 60.60 Effective date: 28 nën 2018

Originator: IEC

Owner: TC 47/SC 47A

Type: International Standard

ICS: 31.200

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

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Scope

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Life cycle

NOW

PUBLISHED
IEC 63011-2:2018 ED1
60.60 Standard published
28 nën 2018

National adoptions

SSH IEC 63011-2:2018

DPS

Qarqe të integruara - Qarqet e integruara tre dimensionale - Pjesa 2: Radhitja e çipeve të lidhura vertikalisht që kanë ndërlidhje me distancë të vogël

60.60 Standard published

DPS/KT 7 më tepër