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IEC 63011-2:2018 ED1

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Nov 28, 2018

General information

60.60     Nov 28, 2018

IEC

TC 47/SC 47A

International Standard

31.200  

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Scope

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Life cycle

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PUBLISHED
IEC 63011-2:2018 ED1
60.60 Standard published
Nov 28, 2018

National adoptions

SSH IEC 63011-2:2018  
DPS

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

60.60 Standard published

DPS/KT 7 more