SSH IEC 63011-2:2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

Publication date: Apr 11, 2019

General information

Current stage: 60.60 Effective date: Jan 29, 2019

Originator: DPS

Owner: DPS/KT 7

Type: Pure national standard

ICS: 31.200

Languages: English

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Status: Published

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IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

SSH IEC 63011-2:2018

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

General information

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Scope

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Adopted from IEC 63011-2:2018 ED1 IDENTICAL