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IEC TR 62866:2014 ED1

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

Publication date: 7 maj 2014

General information

Current stage: 60.60 Effective date: 7 maj 2014

Originator: IEC

Owner: TC 91

Type: Technical Report

ICS: 31.180

Gjuha: anglisht frëngjisht

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Statusi: Publikuar

PDF - 43 532 Lekë

Paper - 43 532 Lekë

CD - 43 532 Lekë

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IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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PUBLISHED
IEC TR 62866:2014 ED1
60.60 Standard published
7 maj 2014