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IEC TR 62866:2014 ED1

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

May 7, 2014

General information

60.60     May 7, 2014

IEC

TC 91

Technical Report

31.180  

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Scope

IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.

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PUBLISHED
IEC TR 62866:2014 ED1
60.60 Standard published
May 7, 2014