DPS
Drejtoria e Përgjithshme e Standardizimit
0 Produkte
Llogaria ime
E-albania
Tel/Cel: +355 4 222 62 55
E-mail: info@dps.gov.al
Adresa: Rr.: "Reshit Collaku", (pranë ILDKPKI, kati VI), Kutia Postare 98, Tiranë - Shqipëri
Main menu

IEC PAS 60191-6-19:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage
22 jan 2008

General information

99.60     25 shk 2010

IEC

TC 47/SC 47D

Publicly Available Specification

31.080.01  

anglisht  

Buying

Replaced

Language in which you want to receive the document.

Scope

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Life cycle

NOW

WITHDRAWN
IEC PAS 60191-6-19:2008 ED1
99.60 Withdrawal effective
25 shk 2010

REVISED BY

PUBLISHED
IEC 60191-6-19:2010 ED1