IEC 60191-6-19:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Publication date: 25 shk 2010

General information

Current stage: 60.60 Effective date: 25 shk 2010

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Publikuar

PDF - 9 046 Lekë

Paper - 9 046 Lekë

CD - 9 046 Lekë

Language

Language in which you want to receive the document.

Scope

IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 60191-6-19:2008 ED1

NOW

PUBLISHED
IEC 60191-6-19:2010 ED1
60.60 Standard published
25 shk 2010