IEC 60749-37:2008 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

Publication date: 30 jan 2008

General information

Current stage: 99.60 Effective date: 12 tet 2022

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

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Scope

Provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface-mounted components while producing the same failure modes normally observed during product level test.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62050:2004 ED1

NOW

WITHDRAWN
IEC 60749-37:2008 ED1
99.60 Withdrawal effective
12 tet 2022

REVISED BY

PUBLISHED
IEC 60749-37:2022 ED2