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IEC 62418:2010 ED1

Semiconductor devices - Metallization stress void test
22 pri 2010

General information

60.60     22 pri 2010

IEC

TC 47

International Standard

31.080.01  

anglisht   frëngjisht  

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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PUBLISHED
IEC 62418:2010 ED1
60.60 Standard published
22 pri 2010