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IEC 62418:2010 ED1

Semiconductor devices - Metallization stress void test

Publication date: Apr 22, 2010

General information

Current stage: 60.60 Effective date: Apr 22, 2010

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French

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Status: Published

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Scope

IEC 62418:2010 describes a method of metallization stress void test and associated criteria. It is applicable to aluminium (Al) or copper (Cu) metallization.

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PUBLISHED
IEC 62418:2010 ED1
60.60 Standard published
Apr 22, 2010