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IEC 60749-4:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

General information

99.60     3 mar 2017

WPUB   

IEC

TC 47

International Standard

31.080.01  

Scope

Modification of the validity date: now put at 2007.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-4:2002 ED1

NOW

WITHDRAWN
IEC 60749-4:2002/COR1:2003 ED1
99.60 Withdrawal effective
3 mar 2017

REVISED BY

PUBLISHED
IEC 60749-4:2017 ED2