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IEC 61191-10-2 ED1

Circuit board assemblies - Part 10-2 : Guideline for Establishing Bonding Parameters in Laser-Assisted Bonding between Semiconductor Chip and Substrate

General information

40.00     3 korr 2026

CCDV    21 gush 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61191-10-2 ED1
40.00 DIS registered
3 korr 2026