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IEC 61191-10-2 ED1

Circuit board assemblies - Part 10-2 : Guideline for the Output Profile Design in Laser-Assisted Bonding

General information

30.99     Jan 23, 2026

TCDV    Jan 26, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

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IN_DEVELOPMENT
IEC 61191-10-2 ED1
30.99 CD approved for registration as DIS
Jan 23, 2026