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IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

30.60     5 qer 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

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IN_DEVELOPMENT
IEC 62878-2-604 ED1
30.60 Close of voting/ comment period
5 qer 2026