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IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

20.99     14 shk 2025

CD    31 korr 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-604 ED1
20.99 WD approved for registration as CD
14 shk 2025