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IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

20.99     Feb 14, 2025

CD    Jul 31, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-604 ED1
20.99 WD approved for registration as CD
Feb 14, 2025