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IEC 62878-2-604 ED1

Device embedding assembly technology - Part 2-604: Guideline for stacked electronic module - Evaluation method of heat transfer for stacked electronic module

General information

30.99     Aug 7, 2026

TCDV    Dec 17, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 62878-2-604 ED1
30.99 CD approved for registration as DIS
Aug 7, 2026