IEC 60749-30:2005 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

Publication date: 10 gush 2011

General information

Current stage: 99.60 Effective date: 17 gush 2020

Next stage: WPUB

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht

Buying

Statusi: Revised

PDF - 19 222 Lekë

Paper - 19 222 Lekë

CD - 19 222 Lekë

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Scope

Establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing in order to evaluate long term reliability.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC PAS 62182:2000 ED1

NOW

WITHDRAWN
IEC 60749-30:2005 ED1
99.60 Withdrawal effective
17 gush 2020

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-30:2005/AMD1:2011 ED1

REVISED BY

PUBLISHED
IEC 60749-30:2020 ED2