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IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

50.00     22 maj 2026

CFDIS    14 gush 2026

IEC

TC 91

International Standard

31.180  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-720 ED1
50.00 Final text received or FDIS registered for formal approval
22 maj 2026