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IEC 61189-3-720 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards

General information

30.60     Mar 7, 2025

IEC

TC 91

International Standard

31.180  

Life cycle

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IN_DEVELOPMENT
IEC 61189-3-720 ED1
30.60 Close of voting/ comment period
Mar 7, 2025