IEC 60749-20:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Publication date: 30 sht 2002

General information

Current stage: 99.60 Effective date: 9 dhj 2008

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Revised

PDF - 16 960 Lekë

Paper - 16 960 Lekë

CD - 16 960 Lekë

Language

Language in which you want to receive the document.

Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-20:2002 ED1
99.60 Withdrawal effective
9 dhj 2008

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-20:2002/COR1:2003 ED1

REVISED BY

WITHDRAWN
IEC 60749-20:2008 ED2