IEC 60749-20:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

Publication date: Sep 30, 2002

General information

Current stage: 99.60 Effective date: Dec 9, 2008

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French Spanish

Buying

Status: Revised

PDF - ALL 16,960

Paper - ALL 16,960

CD - ALL 16,960

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Scope

Applies to semiconductor devices (discrete devices and integrated circuits) - and provides a means of assessing the resistance to soldering heat of plastic-encapsulated surface mount devices.

The contents of the corrigendum of August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

WITHDRAWN
IEC 60749-20:2002 ED1
99.60 Withdrawal effective
Dec 9, 2008

CORRIGENDA / AMENDMENTS

WITHDRAWN
IEC 60749-20:2002/COR1:2003 ED1

REVISED BY

WITHDRAWN
IEC 60749-20:2008 ED2