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IEC 60749-20:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

General information

99.60     Dec 9, 2008

IEC

TC 47

International Standard

31.080.01  

Scope

Modification of the validity date: now put at 2007.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749-20:2002 ED1

NOW

WITHDRAWN
IEC 60749-20:2002/COR1:2003 ED1
99.60 Withdrawal effective
Dec 9, 2008

REVISED BY

WITHDRAWN
IEC 60749-20:2008 ED2