IEC 60749-8:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Publication date: 30 gush 2002

General information

Current stage: 60.60 Effective date: 30 gush 2002

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Gjuha: anglisht frëngjisht spanjisht

Buying

Statusi: Publikuar

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-8:2002 ED1
60.60 Standard published
30 gush 2002

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-8:2002/COR1:2003 ED1

PUBLISHED
IEC 60749-8:2002/COR2:2003 ED1