IEC 60749-8:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

Publication date: Aug 30, 2002

General information

Current stage: 60.60 Effective date: Aug 30, 2002

Originator: IEC

Owner: TC 47

Type: International Standard

ICS: 31.080.01

Languages: English French Spanish

Buying

Status: Published

PDF - ALL 9,046

Paper - ALL 9,046

CD - ALL 9,046

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Scope

Applicable to semiconductor devices (discrete devices and integrated circuits), it determines the leak rate of semiconductor devices.

The contents of the corrigenda of April 2003 and August 2003 have been included in this copy.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

NOW

PUBLISHED
IEC 60749-8:2002 ED1
60.60 Standard published
Aug 30, 2002

CORRIGENDA / AMENDMENTS

PUBLISHED
IEC 60749-8:2002/COR1:2003 ED1

PUBLISHED
IEC 60749-8:2002/COR2:2003 ED1