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IEC 63609-2 ED1

Measurement method used in thermal design for electronics assemblies - Part 2: Measurement method for thermal conductivity of circuit boards with polymer composites

General information

20.99     25 tet 2024

CD    31 tet 2025

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-2 ED1
20.99 WD approved for registration as CD
25 tet 2024