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IEC 63609-2 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

General information

40.00     31 korr 2026

CCDV    18 sht 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

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IN_DEVELOPMENT
IEC 63609-2 ED1
40.00 DIS registered
31 korr 2026