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IEC 63609-2 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

General information

30.99     3 korr 2026

TCDV    31 korr 2026

IEC

TC 91

International Standard

31.180     31.190  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-2 ED1
30.99 CD approved for registration as DIS
3 korr 2026