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IEC 63609-2 ED1

Thermal design of electronics assemblies with miniaturised surface mounting devices and related measurements -<br /> Part 2: Method for evaluating thermal conductivity of circuit boards with polymer composites by using finite element analysis and measurements

General information

30.20     Nov 7, 2025

PCC    Jan 2, 2026

IEC

TC 91

International Standard

31.180     31.190  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63609-2 ED1
30.20 CD study/ballot initiated
Nov 7, 2025

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