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Drejtoria e Përgjithshme e Standardizimit

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IEC 63378-2-2 ED1

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General information

Current stage: 30.20 Effective date: 7 shk 2025

Next stage: PCC Next stage date: 2 maj 2025

Originator: IEC

Owner: TC 47/SC 47D

Type: International Standard

ICS: 31.080.01

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-2-2 ED1
30.20 CD study/ballot initiated
7 shk 2025

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