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IEC 63378-2-2 ED1

Thermal standardization on semiconductor packages - Part 2-2: 3D thermal simulation models of semiconductor packages for steady-state analysis - PBGA and FBGA packages

General information

30.60     May 2, 2025

IEC

TC 47/SC 47D

International Standard

31.080.01  

Life cycle

NOW

IN_DEVELOPMENT
IEC 63378-2-2 ED1
30.60 Close of voting/ comment period
May 2, 2025