DPS
Drejtoria e Përgjithshme e Standardizimit
0 Produkte
Llogaria ime
E-albania
Tel/Cel: +355 4 222 62 55
E-mail: info@dps.gov.al
Adresa: Rr.: "Reshit Collaku", (pranë ILDKPKI, kati VI), Kutia Postare 98, Tiranë - Shqipëri
Main menu

IEC 60749-25:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
11 korr 2003

General information

60.60     11 korr 2003

IEC

TC 47

International Standard

31.080.01  

anglisht   frëngjisht   spanjisht  

Buying

Publikuar

Language in which you want to receive the document.

Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62178:2000 ED1

NOW

PUBLISHED
IEC 60749-25:2003 ED1
60.60 Standard published
11 korr 2003