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IEC 60749-25:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

Jul 11, 2003

General information

60.60     Jul 11, 2003

IEC

TC 47

International Standard

31.080.01  

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Scope

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60749:1996 ED2

WITHDRAWN
IEC 60749:1996/AMD1:2000 ED2

WITHDRAWN
IEC 60749:1996/AMD2:2001 ED2

WITHDRAWN
IEC PAS 62178:2000 ED1

NOW

PUBLISHED
IEC 60749-25:2003 ED1
60.60 Standard published
Jul 11, 2003