IEC 61163-1:2006 ED2

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots

Publication date: 26 qer 2006

General information

Current stage: 60.60 Effective date: 26 qer 2006

Originator: IEC

Owner: TC 56

Type: International Standard

ICS: 03.120.01 03.120.30 21.020

Gjuha: anglisht frëngjisht spanjisht

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Statusi: Publikuar

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Scope

This part of IEC 61163 describes particular methods to apply and optimize reliability stress screening processes for lots of repairable hardware assemblies, in cases where the assemblies have an unacceptably low reliability in the early failure period, and when other methods, such as reliability growth programmes and quality control techniques, are not applicable.

Life cycle

PREVIOUSLY

WITHDRAWN
IEC 60300-3-7:1999 ED1

WITHDRAWN
IEC 61163-1:1995 ED1

WITHDRAWN
IEC 61163-1:1995/COR1:1999 ED1

NOW

PUBLISHED
IEC 61163-1:2006 ED2
60.60 Standard published
26 qer 2006