IEC 61189-3-302:2025 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Publication date: 22 tet 2025

General information

Current stage: 60.60 Effective date: 22 tet 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Gjuha: frëngjisht anglisht

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Statusi: Publikuar

PDF - 13 003 Lekë

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Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

Life cycle

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PUBLISHED
IEC 61189-3-302:2025 ED1
60.60 Standard published
22 tet 2025