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IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

Current stage: 60.00 Effective date: 3 tet 2025

Next stage: PPUB Next stage date: 14 nën 2025

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Scope

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-302 ED1
60.00 Standard under publication
3 tet 2025