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IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

40.99     23 maj 2025

DECFDIS    30 qer 2025

IEC

TC 91

International Standard

31.180  

Scope

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-302 ED1
40.99 Full report circulated: DIS approved for registration as FDIS
23 maj 2025