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IEC 61189-3-302:2025 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

Oct 22, 2025

General information

60.60     Oct 22, 2025

IEC

TC 91

International Standard

31.180  

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IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

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PUBLISHED
IEC 61189-3-302:2025 ED1
60.60 Standard published
Oct 22, 2025

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prSSH EN IEC 61189-3-302:2025  
DPS

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

40.20 DIS ballot initiated: 12 weeks

DPS/KT 8 more