IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

Current stage: 40.20 Effective date: Oct 4, 2024

Next stage: PRVC Next stage date: Dec 27, 2024

Originator: IEC

Owner: TC 91

Type: International Standard

ICS: 31.180

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-302 ED1
40.20 DIS ballot initiated: 12 weeks
Oct 4, 2024

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