IEC 61189-3-302 ED1 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.
IN_DEVELOPMENT
IEC 61189-3-302 ED1
50.20
Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Aug 15, 2025
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