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IEC 61189-3-302 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-302: Detection of plating defects in unpopulated circuit boards by computed tomography (CT)

General information

50.20     Aug 15, 2025

PRVD    Sep 26, 2025

IEC

TC 91

International Standard

31.180  

Scope

IEC 61189-3-302 ED1 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).
This document is applicable to non-destructive testing of metallized holes.

Life cycle

NOW

IN_DEVELOPMENT
IEC 61189-3-302 ED1
50.20 Proof sent to secretariat or FDIS ballot initiated: 8 weeks
Aug 15, 2025

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